Keynote Speaker and Invited Speakers
Invited Speakers who accept the invitation are also invited to attend the "Invited Speaker Meeting" with the Executive Committee on Monday, October 12, 2009 at 8 pm. Light refreshments will be served.
Keynote speaker
Vijay K. Kapur, Ph.D., M.B.A.International Solar Electric Technology, Inc.
Invited Speakers
William Eisenstadt, University of Florida, Characterization of High-Speed Digital and RF Interconnect-Chip-Package SystemsPrabu Gopalraja, AMAT, Extensibility of PVD Barrier and Seed Processes
Rajiv Joshi, IBM, Statistical Aware Design for sub-nm Technology/Design
John Knickerbocker, IBM, Si Carrier for Heterogeneous 2-D and 3-D Integration
Patrick Leduc, CEA Leti MINATEC, Metal Integration Strategies for 3D
Sylvain Mairejean, CEA Leti MINATEC, Advanced Characterization of Integrated Nano Materials
Saibal Mukhopadhyay, Georgia Institute of Technology, TSV Capacitance Modeling
Christopher Muller, Université de Provence France, Resistive Switching Memories
T. Nakamura, Fujitsu, Characterization Methods of Copper Low-k Interconnects
Markus Nopper, Globalfoundaries Dresden, HVM-Qualified CoWP Process
Tony Oates, TSMC, Cu BEOL Reliability
Herbert Struyf, IMEC, Metal Hard-Mask Based Double Patterning for 22nm and Beyond
Emmanuel Van Kerschaver, IMEC, Metallization Challenges in Solar Cells
Thomas Wächtler, Chemnitz University of Technology, Copper Films Grown Via Copper Oxide ALD
Top